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10μF 25V Multilayer Ceramic Chip Capacitor

10μF 25V Multilayer Ceramic Chip Capacitor
10μF 25V Multilayer Ceramic Chip Capacitor
10μF 25V Multilayer Ceramic Chip Capacitor
10μF 25V Multilayer Ceramic Chip Capacitor
10μF 25V Multilayer Ceramic Chip Capacitor
10μF 25V Multilayer Ceramic Chip Capacitor
10μF 25V Multilayer Ceramic Chip Capacitor
10μF 25V Multilayer Ceramic Chip Capacitor
10μF 25V Multilayer Ceramic Chip Capacitor
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$43.43
Ex Tax: $43.43
  • Stock: In Stock
  • Model: RDDLZ-MLCC-25V106K
  • Weight: 1.00
  • SKU: RDDLZ-MLCC-25V106K

Available Options

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Multilayer ceramic chip capacitor is stable and has high capacitance. Laminated monolithic structure, excellent solderability and solder resistance, MLCC capacitors are suitable for reflow and wave soldering, various filtering and coupling circuits.

Specification

  • Model: RDDLZ-25V106K0603
  • Series: Multilayer Ceramic Chip Capacitor
  • Capacitance: 10μF (10000000pF, 10000nF)
  • Rated voltage: 25V
  • Tolerance: 20%
  • Operating Temperature Range: -40℃ - 105℃
  • Lead Type: SMD
  • Size: 16mm
  • Thickness: 0.8mm
  • Package: 4000PCS / roll
  • Application: Household Appliances
  • Medium Material: Ceramic (Porcelain)
  • Loss: 0.01%
  • Weight: 0.8kg

Structure

Tips: Causes of leakage of multilayer ceramic capacitors

  1. Void
    The cavity formed by the volatilization of foreign matter inside the capacitor during the sintering process. Voids can lead to short circuits between electrodes and potential electrical failure. Larger voids not only reduce the IR, but also reduce the effective capacitance. When the power is turned on, it may cause local heating of the cavity due to leakage, reduce the insulation performance of the ceramic medium, aggravate the leakage, and cause cracking, explosion, combustion and other phenomena.
  2. Crack
    Sintering cracks are generally caused by rapid cooling during the sintering process and appear in the vertical direction of the electrode edge.
  3. Delamination
    The occurrence of delamination is often caused by poor lamination or insufficient debinding and sintering after stacking, air is mixed between layers, and jagged lateral cracks appear from external impurities. It may also be caused by a mismatch in thermal expansion after mixing different materials.

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