Solid State Relay Heat Sink For Industrial SSR/1-Phase SSR

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$58.86

Ex Tax: $58.86

Stock: In Stock
Model: RDDLZ-SSR-SHS
Weight: 1.00
SKU: RDDLZ-SSR-SHS

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Light weight single phase solid state relay heat sink is made from high quality materials for durability and is available in a wide range of sizes and styles. Our SSR heat sinks are the perfect solution for dissipating the heat generated by solid state relays.

Note: Please prepare your own thermal grease to allow good contact between the solid state relay and the heat sink.

Specification

Model	Dimension (mm) (LxWxH)	Weight	Application Range
RDDLZ-S-50	50 x 80 x 50	68g	Applied for single phase (10~25A) solid state relays
RDDLZ-S-125	125 x 50 x 70	175g	Applied for single phase (10~60A) solid state relays
RDDLZ-S-100	100 x 50 x 80	200g	Applied for single phase (10~120A) solid state relays
RDDLZ-S-65	65 x 80 x 78	402g	Applied for single phase (10~120A) solid state relays
RDDLZ-S-150	150 x 80 x 50	232.5g	Applied for single phase (10~25A) solid state relays

Dimension (Unit: mm)

Applications

SSR heat sinks are widely used in motor control, lighting control, temperature control, power supplies and industrial automation. Using an RDDLZ solid state relay heat sink helps to ensure that the relay remains cool and operates within a safe temperature range.

Tips: How does a heat sink work?

A heat sink is a device that is used to dissipate heat away from a hot component (such as a CPU or a power transistor) in order to prevent overheating and damage. The heat sink works by increasing the surface area over which heat can be dissipated, which in turn increases the efficiency of the heat transfer process.

Heat is transferred from the hot component to the heat sink through a process called conduction. The heat sink is typically made of a material with high thermal conductivity, such as copper or aluminum. The heat is then dissipated from the heat sink into the surrounding air through a process called convection. This is achieved by increasing the surface area of the heat sink, typically through the use of fins or other structures that increase the amount of air that comes into contact with the heat sink.

In addition to increasing the surface area of the heat sink, it is also important to ensure good thermal contact between the heat sink and the hot component. This is typically achieved through the use of a thermal interface material (TIM), such as thermal paste or a thermal pad, which fills in any gaps or irregularities between the two surfaces and helps to transfer heat more efficiently.

Overall, a heat sink is an important component in many electronic devices that helps to prevent overheating and improve performance and reliability.

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