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1μF 50V Multilayer Ceramic Chip Capacitor

1μF 50V Multilayer Ceramic Chip Capacitor
1μF 50V Multilayer Ceramic Chip Capacitor
1μF 50V Multilayer Ceramic Chip Capacitor
1μF 50V Multilayer Ceramic Chip Capacitor
1μF 50V Multilayer Ceramic Chip Capacitor
1μF 50V Multilayer Ceramic Chip Capacitor
1μF 50V Multilayer Ceramic Chip Capacitor
from
$16.79
Ex Tax: $16.79
  • Stock: In Stock
  • Model: RDDLZ-MLCC-50V105K
  • Weight: 1.00
  • SKU: RDDLZ-MLCC-50V105K

Available Options

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SMD Multilayer ceramic chip capacitor is stable and has high capacitance. Laminated monolithic structure, excellent solderability and solder resistance, MLCC capacitors are suitable for reflow and wave soldering, various filtering and coupling circuits.

Specification

  • Model: RDDLZ-50V105K0805
  • Series: Multilayer Ceramic Chip Capacitor
  • Capacitance: 1μF (1000000pF, 1000nF)
  • Rated voltage: 50V
  • Tolerance: 10%
  • Operating Temperature Range: -40℃ - 105℃
  • Lead Type: SMD
  • Size: 2mm
  • Thickness: 1.25mm
  • Package: 1000PCS / roll
  • Application: Household Appliances
  • Medium Material: Ceramic (Porcelain)
  • Loss: 0.01%
  • Weight: 0.3kg

Structure

Tips: Difference between low frequency ceramic capacitor and high frequency ceramic capacitor

Low frequency ceramic capacitors are limited to bypassing or blocking DC in circuits with lower operating frequencies, or occasions (including high frequencies) that do not require high stability and loss. Such capacitors should not be used in pulsed circuits because they are prone to breakdown by pulsed voltages.

High frequency ceramic capacitors are formed by spraying a special mixture with a concentration suitable for spraying into a thin film, and the dielectric is then sintered with silver layer electrodes to form a "monolithic" structure. High-frequency ceramic capacitors are suitable for high-frequency circuit mica capacitors. In terms of structure, it can be divided into foil type and quilt type. The silver-coated electrode is directly coated with a silver layer on the mica sheet by vacuum evaporation or sintering. Due to the elimination of the air gap, the temperature coefficient is greatly reduced, and the capacitance stability is also higher than that of the foil type.

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