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1μF 250V Multilayer Ceramic Chip Capacitor

1μF 250V Multilayer Ceramic Chip Capacitor
1μF 250V Multilayer Ceramic Chip Capacitor
1μF 250V Multilayer Ceramic Chip Capacitor
1μF 250V Multilayer Ceramic Chip Capacitor
1μF 250V Multilayer Ceramic Chip Capacitor
1μF 250V Multilayer Ceramic Chip Capacitor
1μF 250V Multilayer Ceramic Chip Capacitor
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$18.19
Ex Tax: $18.19
  • Stock: In Stock
  • Model: RDDLZ-MLCC-250V105K
  • Weight: 1.00
  • SKU: RDDLZ-MLCC-250V105K

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SMD Multilayer ceramic chip capacitor is stable and has high capacitance. Laminated monolithic structure, excellent solderability and solder resistance, MLCC capacitors are suitable for reflow and wave soldering, various filtering and coupling circuits.

Specification

  • Model: RDDLZ-250V105K1210
  • Series: Multilayer Ceramic Chip Capacitor
  • Capacitance: 1μF (1000000pF, 1000nF)
  • Rated voltage: 100V
  • Tolerance: 10%
  • Operating Temperature Range: -40℃ - 105℃
  • Lead Type: SMD
  • Size: 3.2mm
  • Thickness: 2.5mm
  • Package: 1000PCS / roll
  • Application: Household Appliances
  • Medium Material: Ceramic (Porcelain)
  • Loss: 0.01%
  • Weight: 0.3kg

Structure

Tips: What causes the multilayer ceramic chip capacitor failure?

  • Thermal crack
    It is mainly due to the temperature shock of the device during soldering, especially wave soldering. Improper rework is also an important cause of temperature shock cracks.
  • Flex crack
    The characteristics of multilayer ceramic capacitors are that they can withstand large compressive stress, but have poor resistance to bending. Any operation during device assembly that may cause bending deformation may cause device cracking. Common stress sources include: SMD alignment, circuit board operation in the process; people, equipment, gravity and other factors in the flow process; through-hole component insertion; circuit testing, veneer segmentation; circuit board installation; circuit board positioning riveting ; Screw installation, etc. Such cracks generally originate from the upper and lower metallized ends of the device, and extend to the inside of the device along an angle of 45°C. This type of defect is also a type of defect that actually occurs the most.

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